Equipotential bonding

The C6 Compact is designed to discharge EMC interference via the mounting rail.

This must therefore be connected to the functional equipotential bonding (can also be the

equipotential bonding). The following points must be observed:

  1. Good, large-surface connection from the mounting rail to the support (if it is conductive)
  2. Low-impedance connection of the support for potential equalisation (e.g. min. 4 mm² cable or ribbon cable)

 

Information on equipotential bonding conductors can be found at HD 60364-5-54!